TY - GEN
T1 - 22.5 A 42GS/s 7b 16nm Massively Time-Interleaved Slope-ADC
AU - Martens, Ewout
AU - Cooman, Adam
AU - Renukaswamy, Pratap
AU - Nagata, Shun
AU - Park, Sehoon
AU - Lagos, Jorge
AU - Markulic, Nereo
AU - Craninckx, Jan
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - For wireline receivers, ADCs with a resolution of 6 to 8 bits and a sampling speed of several tens of GHz are often required [1-5]. To achieve these extremely high speeds, time-interleaved (TI) ADCs with tens of parallel high-speed channels are commonly used. SAR-based sub-ADCs are a popular choice due to their power-efficient architecture. Although SAR ADCs can be small, the need for a DAC and high-speed logic nevertheless results in a significant total area with long interconnection lines. This work introduces an alternative approach for extreme high-speed ADCs based on the paradigm that a slow-speed but extremely small channel allows for a more efficient conversion per area. By arranging them in a 2-dimensional array, interconnections are minimized, and power burned in parasitics is reduced resulting in an energy-efficient and scalable architecture.
AB - For wireline receivers, ADCs with a resolution of 6 to 8 bits and a sampling speed of several tens of GHz are often required [1-5]. To achieve these extremely high speeds, time-interleaved (TI) ADCs with tens of parallel high-speed channels are commonly used. SAR-based sub-ADCs are a popular choice due to their power-efficient architecture. Although SAR ADCs can be small, the need for a DAC and high-speed logic nevertheless results in a significant total area with long interconnection lines. This work introduces an alternative approach for extreme high-speed ADCs based on the paradigm that a slow-speed but extremely small channel allows for a more efficient conversion per area. By arranging them in a 2-dimensional array, interconnections are minimized, and power burned in parasitics is reduced resulting in an energy-efficient and scalable architecture.
UR - http://www.scopus.com/inward/record.url?scp=85188077634&partnerID=8YFLogxK
U2 - 10.1109/ISSCC49657.2024.10454361
DO - 10.1109/ISSCC49657.2024.10454361
M3 - Conference contribution
AN - SCOPUS:85188077634
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 396
EP - 398
BT - 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Solid-State Circuits Conference, ISSCC 2024
Y2 - 18 February 2024 through 22 February 2024
ER -