2D array transducer with a conductive backing

Jeongdong Woo, Wonseok Lee, Sanggon Lee, Yongrae Roh, Hyungkeun Lee, Byungkuk Bae, Eunhee Shin, Sunghag Kim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A new conductive backing has been developed to improve transducer performance and manufacturability. For fabrication, conductive pillars were molded in a polymeric matrix through a process similar to that for the fabrication of 1-3 piezocomposites. The best combination of pillar and backing materials was selected from experiments to achieve the maximum acoustic performance (high impedance and attenuation) and channel uniformity. The 2D array transducer with 4096 channels built had a 3.5MHz center frequency and an over 60% fractional bandwidth. Every single channel of the prototype satisfied the target specifications and the standard deviation over the entire channels was within 0.81dB.

Original languageEnglish
Title of host publication2013 IEEE International Ultrasonics Symposium, IUS 2013
Pages1973-1974
Number of pages2
DOIs
StatePublished - 2013
Event2013 IEEE International Ultrasonics Symposium, IUS 2013 - Prague, Czech Republic
Duration: 21 Jul 201325 Jul 2013

Publication series

NameIEEE International Ultrasonics Symposium, IUS
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

Conference2013 IEEE International Ultrasonics Symposium, IUS 2013
Country/TerritoryCzech Republic
CityPrague
Period21/07/1325/07/13

Keywords

  • 1-3 composite
  • Component
  • Conductive backing
  • Ultrasonic array transducer
  • Volumetric imaging

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