TY - GEN
T1 - 30 nm In0.7Ga0.3as inverted-type HEMTs with reduced gate leakage current for logic applications
AU - Kim, Tae Woo
AU - Kim, Dae Hyun
AU - Del Alamo, Jesus A.
PY - 2009
Y1 - 2009
N2 - We have fabricated 30 nm In0.7Ga0.3As Inverted-Type HEMTs with outstanding logic performance, scalability andhigh frequency characteristics. The motivation for this work is the demonstration of reduced gate leakage current in the Inverted HEMT structure. The fabricated devices show excellent Lg scalability down to 30 nm. Lg = 30 nm devices have been fabricated with exhibit gm = 1.27 mS/μm, S = 83 mV/dec, DIBL = 118 mV/V, ION/IOFF = 4 x 104, all at 0.5 V. More significantly, the removal of dopants from the barrier suppresses forward gate leakage current by over 100X when compared with equivalent normal HEMTs. The Lg = 30 nm devices also feature record high-frequency characteristics for an inverted-type HEMT design with f T = 500 GHz and fmax = 550 GHz.
AB - We have fabricated 30 nm In0.7Ga0.3As Inverted-Type HEMTs with outstanding logic performance, scalability andhigh frequency characteristics. The motivation for this work is the demonstration of reduced gate leakage current in the Inverted HEMT structure. The fabricated devices show excellent Lg scalability down to 30 nm. Lg = 30 nm devices have been fabricated with exhibit gm = 1.27 mS/μm, S = 83 mV/dec, DIBL = 118 mV/V, ION/IOFF = 4 x 104, all at 0.5 V. More significantly, the removal of dopants from the barrier suppresses forward gate leakage current by over 100X when compared with equivalent normal HEMTs. The Lg = 30 nm devices also feature record high-frequency characteristics for an inverted-type HEMT design with f T = 500 GHz and fmax = 550 GHz.
UR - http://www.scopus.com/inward/record.url?scp=77952389541&partnerID=8YFLogxK
U2 - 10.1109/IEDM.2009.5424317
DO - 10.1109/IEDM.2009.5424317
M3 - Conference contribution
AN - SCOPUS:77952389541
SN - 9781424456406
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 20.1.1-20.1.4
BT - 2009 International Electron Devices Meeting, IEDM 2009 - Technical Digest
T2 - 2009 International Electron Devices Meeting, IEDM 2009
Y2 - 7 December 2009 through 9 December 2009
ER -