@inproceedings{3a7cb6d982e84c67931810f88b5ac347,
title = "3D IC power benefit study under practical design considerations",
abstract = "Despite many predictions that 3D IC is the solution for future low-power electronics, few studies describe how this can happen in real designs. In this paper, we investigate the practical design factors that affect the power consumption of 3D IC using a commercial-grade large-scale benchmark (OpenSPARC T2). In particular, we investigate the impact of power distribution network (PDN) in designer's perspective. Our study shows that PDN significantly affects several important design metrics in addition to the total power.",
keywords = "Capacitance, Integrated circuits, Layout, Metals, Routing, Three-dimensional displays, Wires",
author = "Taigon Song and Moongon Jung and Yang Wan and Yarui Peng and Lim, {Sung Kyu}",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 ; Conference date: 18-05-2015 Through 21-05-2015",
year = "2015",
month = nov,
day = "10",
doi = "10.1109/IITC-MAM.2015.7325594",
language = "English",
series = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "335--337",
booktitle = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",
address = "United States",
}