60 nm self-aligned-gate InGaAs HEMTs with record high-frequency characteristics

Tae Woo Kim, Dae Hyun Kim, Jesús A. Del Alamo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

22 Scopus citations

Abstract

We have developed a new self-aligned gate technology for InGaAs High Electron Mobility Transistors with non-alloyed Mo-based ohmic contacts and a very low parasitic capacitance gate design. The new process delivers a contact resistance of 7 Ohm-μm and a source resistance of 147 Ohm-μm. The non-alloyed Mo-based ohmic contacts show excellent thermal stability up to 600 °C. Using this technology, we have demonstrated a 60 nm gate length self-aligned InGaAs HEMT with gm = 2.1 mS/μm at VDS = 0.5 V, and fT = 580 GHz and fmax = 675 GHz at V DS = 0.6 V. These are all record or near record values for this gate length.

Original languageEnglish
Title of host publication2010 IEEE International Electron Devices Meeting, IEDM 2010
Pages30.7.1-30.7.4
DOIs
StatePublished - 2010
Event2010 IEEE International Electron Devices Meeting, IEDM 2010 - San Francisco, CA, United States
Duration: 6 Dec 20108 Dec 2010

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference2010 IEEE International Electron Devices Meeting, IEDM 2010
Country/TerritoryUnited States
CitySan Francisco, CA
Period6/12/108/12/10

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