@inproceedings{9a0978bc97c44c618038bc3fecf6436b,
title = "A 3D inspection system for PCB board by Fusing Moir{\'e} Technique and stereo vision algorithm",
abstract = "Automatic PCB (printed circuit board) assembly technique plays a very important roll in modern industry where electronics is becoming an indispensable part. Each process of assembly requires well-developed inspection technique to ensure quality of the products and prevent waste of resources. In the case of chip mounting inspection, a number of 2D inspection techniques have been developed but there are challenging problems still remaining. In this paper, a 3D measurement method based on phase shining and stereo vision for inspection of chip mounting is proposed. The hardware system and algorithm that employ the proposed methods are developed and are described in detail. The results show that height measurement of the chip-mounted board can be achieved with satisfactory accuracy.",
keywords = "3D sensing, Moire technique, PCB inspection, Phase unwrapping, Stereo vision",
author = "Deokhwa Hong and Hyunki Lee and Minyoung Kim and Hyungsuck Cho",
year = "2007",
doi = "10.1109/SICE.2007.4421405",
language = "English",
isbn = "4907764286",
series = "Proceedings of the SICE Annual Conference",
pages = "2473--2479",
booktitle = "SICE Annual Conference, SICE 2007",
note = "SICE(Society of Instrument and Control Engineers)Annual Conference, SICE 2007 ; Conference date: 17-09-2007 Through 20-09-2007",
}