@inproceedings{c9098ce8bd2841febc05c3fbcda44133,
title = "A fine-grained co-simulation methodology for IR-drop noise in silicon interposer and TSV-based 3D IC",
abstract = "In this paper, we propose a methodology which can co-simulate IR-drop noise for 3D IC, silicon interposer, and PCB simultaneously, and demonstrate how severe the IR-drop is in the silicon interposer. This methodology uses not only PCB and package (silicon interposer) stacking information, but also full transistor-level 3D IC switching information for a precise IR-drop calculation. By utilizing these information, we show the IR-drop noise map of the PDN (Power Distribution Network) in the interposer and the 3D IC mounted on it. Based on our results, we found that (1) the IR-drop noise caused by silicon interposer is very severe to few tens of mV, and (2) our co-analysis method fixes the overestimation of IR-drop caused by the traditional method.",
keywords = "3D IC, Chip, Co-Analysis, Co-Simulation, IR-Drop, Package, PCB, Silicon Interposer",
author = "Taigon Song and Lim, {Sung Kyu}",
year = "2011",
doi = "10.1109/EPEPS.2011.6100236",
language = "English",
isbn = "9781424493999",
series = "2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011",
pages = "239--242",
booktitle = "2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011",
note = "2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 ; Conference date: 23-10-2011 Through 26-10-2011",
}