Abstract
The redundancy scheme without additional wafer process steps and using Ferro-Cap and an externally controlable dummy cell reference scheme is discussed. The use of these techniques makes 1T1C technology production-worthy, low costing with high yields and reliability.The memory cell array is divided into Normal memory cell (MC), redundant cell (RC) and data cell (DC) where redundancy scheme is applied. In the DC region failure information of MC is stored inthe same Ferro-Caps used for MC during wafer test and packaged level test. A Ferro-Cap is biased during standby and without driving the plateline its charge is released to the bitline when the word line is selected.
Original language | English |
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Pages (from-to) | 36-37 |
Number of pages | 2 |
Journal | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
State | Published - 2001 |
Event | Digest of Technical Papers - IEEE International Solid-State Circuits Conference - Duration: 5 Feb 2001 → 6 Feb 2001 |