TY - JOUR
T1 - A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors
AU - Irmler, C.
AU - Bergauer, T.
AU - Frankenberger, A.
AU - Friedl, M.
AU - Gfall, I.
AU - Higuchi, T.
AU - Ishikawa, A.
AU - Joo, C.
AU - Kah, D. H.
AU - Kang, K. H.
AU - Rao, K. K.
AU - Kato, E.
AU - Mohanty, G. B.
AU - Negishi, K.
AU - Onuki, Y.
AU - Shimizu, N.
AU - Tsuboyama, T.
AU - Valentan, M.
PY - 2013
Y1 - 2013
N2 - B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both-minimal material budget and low noise-we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called "Origami" design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO2 system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules.
AB - B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both-minimal material budget and low noise-we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called "Origami" design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO2 system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules.
KW - APV25
KW - Belle II
KW - Chip-on-sensor
KW - Low mass readout
KW - Silicon strip detector
KW - Silicon vertex detector
UR - http://www.scopus.com/inward/record.url?scp=84888867249&partnerID=8YFLogxK
U2 - 10.1016/j.nima.2013.05.169
DO - 10.1016/j.nima.2013.05.169
M3 - Article
AN - SCOPUS:84888867249
SN - 0168-9002
VL - 732
SP - 109
EP - 112
JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
ER -