A simulation study on the thermal buckling behavior of laminated composite shells with embedded shape memory alloy (SMA) wires

Hyo Jik Lee, Jung Ju Lee, Jeung Soo Huh

Research output: Contribution to journalConference articlepeer-review

61 Scopus citations

Abstract

In this paper, numerical simulation analyses of the thermal buckling behavior of laminated composite shells with embedded shape memory alloy (SMA) wires were performed to investigate the effect of embedded SMA wires on the characteristics of thermal buckling. In order to simulate the thermomechanical behavior of SMA wires, the constitutive equation of the SMA wires was formulated in the form of an ABAQUS user subroutine. The computational program was verified by showing the response of the pseudoelasticity and shape memory effect (SME) at various temperatures and stress levels. Modeling of the laminated composite shells with embedded SMA wires and thermal buckling analyses were performed with the use of the ABAQUS code linked with the subroutine of the formulated SMA constitutive equations. The thermal buckling analyses of the composite shells with embedded SMA wires show that the critical buckling temperature can be increased and the thermal buckling deformation can be decreased by using the activation force of embedded SMA wire actuators. (C) 2000 Published by Elsevier Science Ltd.

Original languageEnglish
Pages (from-to)463-469
Number of pages7
JournalComposite Structures
Volume47
Issue number1-4
DOIs
StatePublished - Dec 1999
Event10th International Conference on Composite Structures - Melbourne, Aust
Duration: 15 Nov 199916 Nov 1999

Keywords

  • Constitutive equation
  • Critical buckling temperature
  • Shape memory effect
  • Smart structures
  • Thermal buckling

Fingerprint

Dive into the research topics of 'A simulation study on the thermal buckling behavior of laminated composite shells with embedded shape memory alloy (SMA) wires'. Together they form a unique fingerprint.

Cite this