A study of interfacial layer effect synthesized by high energy ion cascade on adhesion strength deterioration between copper thin film and polyimide substrates

Y. M. Chung; W. S. Jung; C. S. Moon; J. G. Han

A study of interfacial layer effect synthesized by high energy ion cascade on adhesion strength deterioration between copper thin film and polyimide substrates

Y. M. Chung, W. S. Jung, C. S. Moon, J. G. Han

Department of Physics

Sungkyunkwan University

Research output: Contribution to journal › Conference article › peer-review

Abstract

Highly adhesive Cu clad laminates (CCL) without oxygen plasma treatment were fabricated by introducing Ti layer using grid assisted magnetron sputtering. The interfaces of polyimide and titanium obtained were studied by XPS. The results give evidence for the formation of Ti-O-C chemical bonds between two sides. These chemical bonds are believed to be responsible for the observed mechanical strength of the CCL bonding.

Original language	English
Pages (from-to)	739-743
Number of pages	5
Journal	Proceedings, Annual Technical Conference - Society of Vacuum Coaters
State	Published - 2005
Event	SVC, Society of Vacuum Coaters - 48th Annual Technical Conference - Denver, CO, United States Duration: 23 Apr 2005 → 28 Apr 2005

Keywords

Adhesion
Copper clad laminate
Grid assisted magnetron sputtering
Polyimide

Cite this

@article{0861b154060c4d29b1e83b04f0949875,

title = "A study of interfacial layer effect synthesized by high energy ion cascade on adhesion strength deterioration between copper thin film and polyimide substrates",

abstract = "Highly adhesive Cu clad laminates (CCL) without oxygen plasma treatment were fabricated by introducing Ti layer using grid assisted magnetron sputtering. The interfaces of polyimide and titanium obtained were studied by XPS. The results give evidence for the formation of Ti-O-C chemical bonds between two sides. These chemical bonds are believed to be responsible for the observed mechanical strength of the CCL bonding.",

keywords = "Adhesion, Copper clad laminate, Grid assisted magnetron sputtering, Polyimide",

author = "Chung, {Y. M.} and Jung, {W. S.} and Moon, {C. S.} and Han, {J. G.}",

year = "2005",

language = "English",

pages = "739--743",

journal = "Proceedings, Annual Technical Conference - Society of Vacuum Coaters",

issn = "0737-5921",

publisher = "Society of Vacuum Coaters",

note = "SVC, Society of Vacuum Coaters - 48th Annual Technical Conference ; Conference date: 23-04-2005 Through 28-04-2005",

}

A study of interfacial layer effect synthesized by high energy ion cascade on adhesion strength deterioration between copper thin film and polyimide substrates. / Chung, Y. M.; Jung, W. S.; Moon, C. S. et al.
In: Proceedings, Annual Technical Conference - Society of Vacuum Coaters, 2005, p. 739-743.

Research output: Contribution to journal › Conference article › peer-review

TY - JOUR

T1 - A study of interfacial layer effect synthesized by high energy ion cascade on adhesion strength deterioration between copper thin film and polyimide substrates

AU - Chung, Y. M.

AU - Jung, W. S.

AU - Moon, C. S.

AU - Han, J. G.

PY - 2005

Y1 - 2005

N2 - Highly adhesive Cu clad laminates (CCL) without oxygen plasma treatment were fabricated by introducing Ti layer using grid assisted magnetron sputtering. The interfaces of polyimide and titanium obtained were studied by XPS. The results give evidence for the formation of Ti-O-C chemical bonds between two sides. These chemical bonds are believed to be responsible for the observed mechanical strength of the CCL bonding.

AB - Highly adhesive Cu clad laminates (CCL) without oxygen plasma treatment were fabricated by introducing Ti layer using grid assisted magnetron sputtering. The interfaces of polyimide and titanium obtained were studied by XPS. The results give evidence for the formation of Ti-O-C chemical bonds between two sides. These chemical bonds are believed to be responsible for the observed mechanical strength of the CCL bonding.

KW - Adhesion

KW - Copper clad laminate

KW - Grid assisted magnetron sputtering

KW - Polyimide

UR - http://www.scopus.com/inward/record.url?scp=33644969168&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:33644969168

SN - 0737-5921

SP - 739

EP - 743

JO - Proceedings, Annual Technical Conference - Society of Vacuum Coaters

JF - Proceedings, Annual Technical Conference - Society of Vacuum Coaters

T2 - SVC, Society of Vacuum Coaters - 48th Annual Technical Conference

Y2 - 23 April 2005 through 28 April 2005

ER -

A study of interfacial layer effect synthesized by high energy ion cascade on adhesion strength deterioration between copper thin film and polyimide substrates

Abstract

Keywords

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