TY - GEN
T1 - A two-step set operation for highly uniform resistive swtiching ReRAM by controllable filament
AU - Lee, Sangheon
AU - Lee, Daeseok
AU - Woo, Jiyong
AU - Cha, Euijun
AU - Hwang, Hyunsang
PY - 2013
Y1 - 2013
N2 - For the first time, we demonstrate filament controllability by a two-step set operation based on triple-layer ReRAM. Hence, we report a highly reliable memory switching of a triple-layer structure based on resistive switching memory devices by inserting an additional binary metal oxide layer. The inserted oxide layer in the triple-layer can act as a filament controlling factor with the two-step set operation for reliable resistive switching. Compared with the bi-layer structure, the three layers of the two-step set operation showed excellent uniform Vset, Vreset, high-resistance state (RHRS), and low-resistance state (RLRS). Furthermore, the devices exhibited excellent memory performance such as endurance, resistance on/off ratio, and reliable data retention of up to 104 s at 180°C.
AB - For the first time, we demonstrate filament controllability by a two-step set operation based on triple-layer ReRAM. Hence, we report a highly reliable memory switching of a triple-layer structure based on resistive switching memory devices by inserting an additional binary metal oxide layer. The inserted oxide layer in the triple-layer can act as a filament controlling factor with the two-step set operation for reliable resistive switching. Compared with the bi-layer structure, the three layers of the two-step set operation showed excellent uniform Vset, Vreset, high-resistance state (RHRS), and low-resistance state (RLRS). Furthermore, the devices exhibited excellent memory performance such as endurance, resistance on/off ratio, and reliable data retention of up to 104 s at 180°C.
UR - https://www.scopus.com/pages/publications/84902152587
U2 - 10.1109/ESSDERC.2013.6818848
DO - 10.1109/ESSDERC.2013.6818848
M3 - Conference contribution
AN - SCOPUS:84902152587
SN - 9781479906499
T3 - European Solid-State Device Research Conference
SP - 178
EP - 181
BT - ESSDERC 2013 - Proceedings of the 43rd European Solid-State Device Research Conference
PB - IEEE Computer Society
T2 - 43rd European Solid-State Device Research Conference, ESSDERC 2013
Y2 - 16 September 2013 through 20 September 2013
ER -