@inproceedings{5f4d9284441146eca3f5c824de34fbe4,
title = "Analysis of power distribution network in TSV-based 3D-IC",
abstract = "To reduce simultaneous switching noise (SSN) in a PDN design of TSV-based GPU system, the impedance properties of the hierarchical PDN in the TSV-based GPU system were estimated and analyzed. The system consisted of triple-stacked TSV-based DRAMs on top of the GPU connected by TSVs, a silicon interposer, and a backside re-distribution layer (BS-RDL). A segmentation-based impedance-estimation method was used for the estimation of the total PDN impedance combining models of the on-chip PDN, the power/ground (P/G) TSV, and the coplanar P/G line in the BS-RDL. The impedance properties of the PDN were also analyzed with respect to variations in the number of P/G TSVs and P/G lines in the BS-RDL and variation of the capacitance of the on-chip decoupling capacitor embedded in the on-chip PDN.",
keywords = "Coplanar P/G line, Hierarchical power distribution network (PDN), On-chip decoupling capacitor, P/G TSV, Segmentation method",
author = "Kiyeong Kim and Woojin Lee and Jaemin Kim and Taigon Song and Joohee Kim and Pak, {Jun So} and Joungho Kim and Hyungdong Lee and Yongkee Kwon and Kunwoo Park",
year = "2010",
doi = "10.1109/EPEPS.2010.5642575",
language = "English",
isbn = "9781424468652",
series = "2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010",
publisher = "IEEE Computer Society",
pages = "177--180",
booktitle = "2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010",
address = "United States",
}