Analysis of temperature distribution and optimization of the configuration at heating tool in the chip bonding process at camera module of mobile phone

In Kim, Sung Hwan Kweon, Seung Han Yang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publicationProceedings of the 21st Annual ASPE Meeting, ASPE 2006
StatePublished - 2006
Event21st Annual Meeting of the American Society for Precision Engineering, ASPE 2006 - Monterey, CA, United States
Duration: 15 Oct 200620 Oct 2006

Publication series

NameProceedings of the 21st Annual ASPE Meeting, ASPE 2006

Conference

Conference21st Annual Meeting of the American Society for Precision Engineering, ASPE 2006
Country/TerritoryUnited States
CityMonterey, CA
Period15/10/0620/10/06

Cite this