@inproceedings{1c918f43a4234f01958693ea7c541589,
title = "Analysis of temperature distribution and optimization of the configuration at heating tool in the chip bonding process at camera module of mobile phone",
author = "In Kim and Kweon, {Sung Hwan} and Yang, {Seung Han}",
year = "2006",
language = "English",
isbn = "1887706410",
series = "Proceedings of the 21st Annual ASPE Meeting, ASPE 2006",
booktitle = "Proceedings of the 21st Annual ASPE Meeting, ASPE 2006",
note = "21st Annual Meeting of the American Society for Precision Engineering, ASPE 2006 ; Conference date: 15-10-2006 Through 20-10-2006",
}