Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs

Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Jun So Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

31 Scopus citations

Abstract

It is widely-known that coupling exists between adjacent through-silicon vias (TSVs) in 3D ICs. Since this TSV-to-TSV coupling is not negligible, it is highly likely that TSV-to-TSV coupling affects crosstalk significantly. Although a few works have already analyzed coupling in 3D ICs, they used S-parameter-based methods under the assumption that all ports in their simulation structures are under 50- termination condition. However, this 50- termination condition does not occur at ports (pins) of gates inside a 3D IC. In this paper, therefore, we analyze TSV-to-TSV coupling in 3D ICs based on a lumped circuit model with a realistic high-impedance termination condition. We also analyze how channel affect TSV-to-TSV coupling differently in different frequency ranges. Based on our results, we propose a technique to reduce TSV-to-TSV coupling in 3D ICs.

Original languageEnglish
Title of host publicationProceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011
Pages122-128
Number of pages7
DOIs
StatePublished - 2011
Event12th International Symposium on Quality Electronic Design, ISQED 2011 - Santa Clara, CA, United States
Duration: 14 Mar 201116 Mar 2011

Publication series

NameProceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011

Conference

Conference12th International Symposium on Quality Electronic Design, ISQED 2011
Country/TerritoryUnited States
CitySanta Clara, CA
Period14/03/1116/03/11

Keywords

  • 3D IC
  • Capacitive termination
  • Coupling
  • Crosstalk
  • High impedance termination
  • Through-Silicon Via (TSV)

Fingerprint

Dive into the research topics of 'Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs'. Together they form a unique fingerprint.

Cite this