Anisotropic thermal characteristics of graphene-embedded polyimide composite sheets

Seong Yeob Park, Jong Seong Bae, Jin Gyu Kim, Min Wook Oh, Jungsoo Kim, Dae Geun Nam, Jeong Hyun Yeum, Weontae Oh

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Polyimide-graphene (PIG) composites were prepared, and their thermal properties were characterized as films or sheets. Graphene loadings were controlled up to 8 wt.% or 12 wt.% in their composites. The graphenes used in this work were prepared by the chemical treatment of graphite. The as-prepared polyimide-graphene composites were thermally characterized in films or sheets. The thermal conductivities of the PIG sheets were separately analyzed in both in-plane and out-of-plane directions. The thermal expansion coefficients (TECs) of the PIG composites slightly changed with the amount of graphene added to the composites. The in-plane thermal conductivities were higher than the out-of-plane thermal conductivities, and the thermal conductivities of both directions proportionally increased with the graphene loadings in the PIG composites. The temperature-dependent stresses of the composite films monotonically decreased with the graphene loadings. The experimentally obtained thermal characteristics of the polyimide-graphene composites were compared and discussed on the basis of the composite morphologies.

Original languageEnglish
Pages (from-to)315-322
Number of pages8
JournalPolymers and Polymer Composites
Volume24
Issue number5
DOIs
StatePublished - Jun 2016

Keywords

  • Composite film
  • Graphene
  • Stress
  • Thermal conductivity
  • Thermal expansion coefficient

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