Characterization of mechanical damage on structural and electrical properties of silicon wafers

Engineering

• Silicon Wafer 100%
• Mechanical Damage 100%
• Minority Carriers 33%
• Carrier Lifetime 33%
• Experimental Result 16%
• Atomic Force Microscope 16%
• Process Parameter 16%
• Wet Oxidation 16%
• Property Relationship 16%
• Laser Excitation 16%
• Honing 16%
• Displacement Method 16%

Material Science

• Silicon Wafer 100%
• Stacking Fault 66%
• Carrier Lifetime 66%
• Oxidation Reaction 33%
• Density 33%
• Electrical Property 33%