Chemically modified boron nitride-epoxy terminated dimethylsiloxane composite for improving the thermal conductivity

Kiho Kim, Myeongjin Kim, Yongseon Hwang, Jooheon Kim

Research output: Contribution to journalArticlepeer-review

200 Scopus citations

Abstract

The thermal conductivities of composites with an epoxy-terminated dimethylsiloxane (ETDS) matrix and boron nitride (BN) powder fillers were investigated. Two surface curing agents, 3-glycidoxypropyltrimethoxysilane (KBM-403) and 3-chloropropyltrimethoxysilane (KBM-703), were doped onto the surfaces of hydroxyl-functionalized boron nitride using a simple sol-gel process to act as fillers in the thermally conducting composites. These synthesized materials were embedded in epoxy resin via a solvent casting method. The surface modification had an appreciable effect on the thermal conductivity resulting in increased thermal conductivity up to 70 wt%. The thermal conductivities of the composites containing 70 wt% BN particles treated with the KBM-403 and KBM-703 curing agents were 4.11 and 3.88 W/mK, respectively, compared to 2.92 W/mK for the composite without surface treatment.

Original languageEnglish
Pages (from-to)2047-2056
Number of pages10
JournalCeramics International
Volume40
Issue number1 PART B
DOIs
StatePublished - Jan 2014

Keywords

  • B. Composites
  • C. Thermal conductivity
  • D. Nitrides
  • Surface treatment

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