Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter

Taigon Song, Jiseong Kim, Junso Pak, Joungho Kim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

DC/DC Converters are now an essential part in a system due to the various needs of supply voltage that is necessary for different circuits in the system. However, there are many papers which have dealt for efficiency or for a novel structure that would be customized to the specific design, but few dealt with the noise characteristics of DC/DC Converters which could critically affect to the output supply voltage the target circuit would need. In this paper we analyzed the effect of noise to a DC/DC Converter in a chip-package co-design. We figured out that the decoupling capacitors on the PCB board cannot shield all the noise that could affect to the DC/DC converter, and on-chip decoupling capacitor for a DC/DC Converter would be necessary.

Original languageEnglish
Title of host publicationProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
Pages285-288
Number of pages4
DOIs
StatePublished - 2009
Event20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009 - Zurich, Switzerland
Duration: 12 Jan 200916 Jan 2009

Publication series

NameProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009

Conference

Conference20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
Country/TerritorySwitzerland
CityZurich
Period12/01/0916/01/09

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