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Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter

  • Korea Advanced Institute of Science and Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

DC/DC Converters are now an essential part in a system due to the various needs of supply voltage that is necessary for different circuits in the system. However, there are many papers which have dealt for efficiency or for a novel structure that would be customized to the specific design, but few dealt with the noise characteristics of DC/DC Converters which could critically affect to the output supply voltage the target circuit would need. In this paper we analyzed the effect of noise to a DC/DC Converter in a chip-package co-design. We figured out that the decoupling capacitors on the PCB board cannot shield all the noise that could affect to the DC/DC converter, and on-chip decoupling capacitor for a DC/DC Converter would be necessary.

Original languageEnglish
Title of host publicationProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
Pages285-288
Number of pages4
DOIs
StatePublished - 2009
Event20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009 - Zurich, Switzerland
Duration: 12 Jan 2009 → 16 Jan 2009

Publication series

NameProceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009

Conference

Conference20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009
Country/TerritorySwitzerland
CityZurich
Period12/01/09 → 16/01/09

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