Abstract
This paper proposes using hourglass-shaped metal filaments to improve the ON/OFF resistance ratio and retention characteristics of switching devices used in reconfigurable logic applications. These filaments are obtained by controlling the Cu-ion mobility in multi-layer oxide electrolytes. By adopting an upper AlOX and lower TiO2 electrolyte layers with respectively low and high Cu-ion mobility, we could form hourglass-shaped filaments as a result of suppressed Cu-ion injection and enhanced filament lateral growth. The hourglass-shaped metal filaments induced local Joule heating at the filament constriction, thus accelerating RESET operations. We confirmed that, as a result, Cu/AlOX/TiO2/W devices show high ON/OFF resistance ratios (>106) and ∼10-year retention properties at 80°C.
| Original language | English |
|---|---|
| Pages (from-to) | Q219-Q221 |
| Journal | ECS Journal of Solid State Science and Technology |
| Volume | 5 |
| Issue number | 9 |
| DOIs | |
| State | Published - 2016 |
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