TY - JOUR
T1 - Continuous Fabrication of Wide-Tip Microstructures for Bio-Inspired Dry Adhesives via Tip Inking Process
AU - Lee, Sung Ho
AU - Park, Cheol Woo
AU - Kwak, Moon Kyu
N1 - Publisher Copyright:
© 2019 Sung Ho Lee et al.
PY - 2019
Y1 - 2019
N2 - In this paper, we report a new method for continuous fabrication of dry adhesives composed of microstructures with mushroom-shaped ends. Conventional mushroom microstructure fabrication is performed with a simple molding technique using a reversed phase master. In a typical fabrication process, thin- and wide-tip portions may be ripped during demolding, making it difficult to use in a continuous process. It is also difficult to apply the mushroom structure master to a continuous process system in roll form. Here, a continuous fabrication process was developed by applying the method of fabricating a wide tip using a tip inking method after forming a micropillar. Through the continuous process, the dry adhesive was successfully fabricated and the durability was measured with a reasonable pull-off strength (13 N/cm2). In addition to the reasonable adhesion, high durability is guaranteed, and fabricated dry adhesives are expected to be used in various fields.
AB - In this paper, we report a new method for continuous fabrication of dry adhesives composed of microstructures with mushroom-shaped ends. Conventional mushroom microstructure fabrication is performed with a simple molding technique using a reversed phase master. In a typical fabrication process, thin- and wide-tip portions may be ripped during demolding, making it difficult to use in a continuous process. It is also difficult to apply the mushroom structure master to a continuous process system in roll form. Here, a continuous fabrication process was developed by applying the method of fabricating a wide tip using a tip inking method after forming a micropillar. Through the continuous process, the dry adhesive was successfully fabricated and the durability was measured with a reasonable pull-off strength (13 N/cm2). In addition to the reasonable adhesion, high durability is guaranteed, and fabricated dry adhesives are expected to be used in various fields.
UR - http://www.scopus.com/inward/record.url?scp=85060114593&partnerID=8YFLogxK
U2 - 10.1155/2019/4827918
DO - 10.1155/2019/4827918
M3 - Article
AN - SCOPUS:85060114593
SN - 2090-9063
VL - 2019
JO - Journal of Chemistry
JF - Journal of Chemistry
M1 - 4827918
ER -