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Curing of 1-Transistor-DRAM by Joule Heat from Punch-Through Current

  • Hyun Jung Kim
  • , Geon Beom Lee
  • , Joon Kyu Han
  • , Seong Joo Han
  • , Da Jin Kim
  • , Ji Man Yu
  • , Myung Su Kim
  • , Yang Kyu Choi
  • Korea Advanced Institute of Science and Technology

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

The 1-Transistor-DRAM (1T-DRAM) with a floating body is iteratively operated and deteriorated as the number of programming cycles is increased. This aging results an increase in the interface trap density ( {N}-{\text {it}}{)}. Internal electro-Thermal annealing (ETA) using Joule heat generated by punch-Through current flowing from the source via the channel to the drain, reduces the {N}-{\text {it}} and eventually cures the operating damage of the 1T-DRAM. To quantitatively analyze the {N}-{\text {it}} before and after curing, a synchronized optical charge pumping (SOCP) method that is applicable even to a floating body (FB) device, was used. By adopting self-curing during 1T-DRAM operations, endurance was notably increased by reducing {N}-{\text {it}}. It is expected that aged 1T-DRAMs can be recovered when such ETA is enabled at the moment of system rebooting.

Original languageEnglish
Pages (from-to)370-373
Number of pages4
JournalIEEE Electron Device Letters
Volume43
Issue number3
DOIs
StatePublished - 1 Mar 2022

Keywords

  • 1-Transistor-DRAM (1T-DRAM)
  • Curing
  • electro-Thermal annealing (ETA)
  • floating body (FB)
  • gate-All-Around (GAA)
  • hot-carrier injection (HCI)
  • interface trap density
  • Joule heat
  • punch-Through
  • single transistor latch (STL)
  • synchronized optical charge pumping (SOCP)

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