TY - GEN
T1 - Design and fabrication of a new multi-active-layer transducer with a single-copper-layer FPCB
AU - Shin, Eunhee
AU - Lee, Sangseok
AU - Kim, Jongkil
AU - Bae, Byungkuk
AU - Kim, Heewon
AU - Lee, Susung
AU - Roh, Yongrae
PY - 2013
Y1 - 2013
N2 - A diagnostic ultrasound transducer which operates at low frequency and has a small pitch has a high resultant element electrical impedance, aggravating the impedance mismatch which typically occurs between an ultrasound array and cable. A transducer constructed from multiple layers of active material that are electrically in parallel is one way to improve this impedance mismatch. Such a multi-active-layer transducer is most commonly composed of odd numbers of piezoelectric layers to simplify the electrical connections, so a three-layered structure is the simplest choice. But then the design thickness of each of the three PZT layers for a 3.5MHz transducer would be less than 100μm, which is too thin to fabricate easily and too risky to handle. In this paper, a two-active-layer structure is presented that reduces the breakage risk while achieving a lower impedance and thereby improving the transducer performance. A single-copper-layer flexible printed circuit board (FPCB) is developed to electrically connect the two PZT layers. The two-active-layer transducer presented is a phased array with a 3.5MHz center frequency, 150μm pitch, and 128 elements. The transducer is designed using a finite-element analysis program (PZflex) and then fabricated in accordance with the optimal design. The two-active-layer array performance is compared with a single-active-layer transducer that is similarly optimized.
AB - A diagnostic ultrasound transducer which operates at low frequency and has a small pitch has a high resultant element electrical impedance, aggravating the impedance mismatch which typically occurs between an ultrasound array and cable. A transducer constructed from multiple layers of active material that are electrically in parallel is one way to improve this impedance mismatch. Such a multi-active-layer transducer is most commonly composed of odd numbers of piezoelectric layers to simplify the electrical connections, so a three-layered structure is the simplest choice. But then the design thickness of each of the three PZT layers for a 3.5MHz transducer would be less than 100μm, which is too thin to fabricate easily and too risky to handle. In this paper, a two-active-layer structure is presented that reduces the breakage risk while achieving a lower impedance and thereby improving the transducer performance. A single-copper-layer flexible printed circuit board (FPCB) is developed to electrically connect the two PZT layers. The two-active-layer transducer presented is a phased array with a 3.5MHz center frequency, 150μm pitch, and 128 elements. The transducer is designed using a finite-element analysis program (PZflex) and then fabricated in accordance with the optimal design. The two-active-layer array performance is compared with a single-active-layer transducer that is similarly optimized.
KW - Multi-active-layer transducer
KW - Single-copper-layer FPCB
KW - Two-active-layer- structure
UR - http://www.scopus.com/inward/record.url?scp=84894375890&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2013.0504
DO - 10.1109/ULTSYM.2013.0504
M3 - Conference contribution
AN - SCOPUS:84894375890
SN - 9781467356862
T3 - IEEE International Ultrasonics Symposium, IUS
SP - 1975
EP - 1978
BT - 2013 IEEE International Ultrasonics Symposium, IUS 2013
T2 - 2013 IEEE International Ultrasonics Symposium, IUS 2013
Y2 - 21 July 2013 through 25 July 2013
ER -