Design and fabrication of an IC compatible on-chip thermoelectric cooler

Ik Su Kang, Seong Ho Kong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The designing and fabrication of an on-chip integrated thin film-based thermoelectric cooler and the characterization of fabricated material are discussed. A thin film-based Peltier device was realized using the standard IC fabrication technology followed by bulk micromachining technology. electrochemically controlled etch (ECE) was performed to define thermal mass from 4μm-thick epi-layer, suspended underneath the SiN/SiO2 membrane. The thermal, electric and thermoelectric properties of the test structure were measured.

Original languageEnglish
Title of host publicationDigest of Papers - Microprocesses and Nanotechnology 2004
Pages294-295
Number of pages2
StatePublished - 2004
Event2004 International Microprocesses and Nanotechnology Conference - Osaka, Japan
Duration: 26 Oct 200429 Oct 2004

Publication series

NameDigest of Papers - Microprocesses and Nanotechnology 2004

Conference

Conference2004 International Microprocesses and Nanotechnology Conference
Country/TerritoryJapan
CityOsaka
Period26/10/0429/10/04

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