Abstract
The purpose of this study was to investigate the effects of reaction pH conditions on thermal behavior of urea-formaldehyde (UF) resins, for the possible reduction of formaldehyde emission of particleboard bonded with them. Thermal curing properties of UF resins, synthesized at three different reaction pH conditions, such as alkaline (pH 7.5), weak acid (pH 4.5), and strong acid (pH 1.0), were characterized with multiheating rate method of differential scanning calorimetry. As heating rate increased, the onset and peak temperatures increased for all three UF resins. By contrast, the heat of reaction (ΔH) was not much changed with increasing heating rates. The activation energy (Ea) increased as the reaction pH decreased from alkaline to strong acid condition. The formaldehyde emission of particleboard was the lowest for the UF resins prepared under strong acid, whereas it showed the poorest bond strength. These results indicated that thermal curing behavior was related to chemical species, affecting the formaldehyde emission, while the poor bond strength was believed to be related to the molecular mobility of the resin used.
| Original language | English |
|---|---|
| Pages (from-to) | 422-427 |
| Number of pages | 6 |
| Journal | Journal of Applied Polymer Science |
| Volume | 100 |
| Issue number | 1 |
| DOIs | |
| State | Published - 5 Apr 2006 |
Keywords
- Adhesives
- Differential scanning calorimetry
- Thermal properties
- Thermosets