Effect of Electroless Ni-P Plating on the Bonding Strength of Bi-Te-Based Thermoelectric Modules

S. S. Kim, I. Son, K. T. Kim

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

In the present study, electroless Ni-P plating was applied to Bi-Te-based thermoelectric materials as a barrier layer and the effect of the Ni-P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n-and p-type modules increased after being subjected to the electroless Ni-P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni-P plating, Sn and Te were interdiffused and formed a brittle Sn-Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi-Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.

Original languageEnglish
Pages (from-to)1225-1229
Number of pages5
JournalArchives of Metallurgy and Materials
Volume62
Issue number2
DOIs
StatePublished - 1 Jun 2017

Keywords

  • Bi-Te
  • Bonding strength
  • Ni-P plating
  • Soldering
  • Thermoelectric

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