Abstract
The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis. Anodizing was conducted for 20 min at 200 and 400 A/m2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3·16H2O at 20 °C. Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films. The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without, indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy. Second phase precipitates such as Si, Al-Cu-Mg and Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application of ECAP. Al-Cu-Mg intermetallic compounds are dissolved during anodization, whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al. FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds, since the anodic oxide films are absent at the boundary between the normal oxide films and these impurity precipitates. The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates, which act as origins of pitting corrosion.
Original language | English |
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Pages (from-to) | 904-908 |
Number of pages | 5 |
Journal | Transactions of Nonferrous Metals Society of China (English Edition) |
Volume | 19 |
Issue number | 4 |
DOIs | |
State | Published - Aug 2009 |
Keywords
- aluminum-copper alloy
- anodizing
- equal-channel angular pressing
- pitting corrosion