Abstract
Bulk, single-crystal ZnO was etched in Cl2/Ar and CH 4/H2/Ar inductively coupled plasmas as a function of ion impact energy. For CH4/H2/Ar, the etch rate (R) increases with ion energy (E) as predicted from a model of ion enhanced sputtering by a collision-cascade process, R∝(E0.5-ETH 0.5), where the threshold energy, ETH, is ∼96eV. Band edge photoluminescence intensity decreases with incident ion energy in both chemistries, with a 70% decrease even for low energies (∼116eV). Surface roughness is also a function of ion energy with a minimum at ∼250eV, where Auger electron spectroscopy shows there is no measurable change in near-surface stoichiometry from that of unetched control samples.
| Original language | English |
|---|---|
| Pages (from-to) | 3546-3548 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 81 |
| Issue number | 19 |
| DOIs | |
| State | Published - 4 Nov 2002 |