Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea-formaldehyde resin and properties of particleboard

Byung Dae Park, Eun Chang Kang, Jong Yong Park

Research output: Contribution to journalArticlepeer-review

117 Scopus citations

Abstract

As a part of abating the formaldehyde emission (FE) of urea-formaldehyde (UP) resin, this study was conducted to investigate the effects of formaldehyde to urea (F/U) mole ratio on thermal curing behavior of UF resins and properties of PB bonded with them. UF resins synthesized at different F/U mole ratios (i.e., 1.6, 1.4, 1.2, and 1.0) were used for the manufacture of PB. Thermal curing behavior of these UF resins was characterized using differential scanning calorimetry (DSC). As the F/U mole ratio decreases, the gel time, onset and peak temperatures, and heat of reaction (ΔH) increased, while the activation energy (Ea) and rate constant (k) were decreased. The amount of free formaldehyde of UF resin and FE of PB prepared decreased in parallel with decreasing the F/U mole ratio. The internal bond strength, thickness swelling, and water absorption of PB was slightly deteriorated with decreasing the F/U mole ratio of UF resins used. These results indicated that as the F/U mole ratio decreased, the FE of PB was greatly reduced at the expense of the reactivity of UF resin and slight deterioration of performance of PB prepared.

Original languageEnglish
Pages (from-to)1787-1792
Number of pages6
JournalJournal of Applied Polymer Science
Volume101
Issue number3
DOIs
StatePublished - 5 Aug 2006

Keywords

  • Formaldehyde emission
  • Formaldehyde to urea mole ratio
  • Particleboard
  • Thermal behavior
  • Urea-formaldehyde resin

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