TY - JOUR
T1 - Effects of surface charge density on emulsion kinetics and secondary particle formation in emulsifier-free seeded emulsion polymerization of methyl methacrylate
AU - Cheong, I. W.
AU - Kim, J. H.
PY - 1997/8
Y1 - 1997/8
N2 - Experiments were carried out to investigate the effects of surface charge density on emulsion kinetics and secondary particle formation in emulsifier-free seeded emulsion polymerization. Three monodisperse seed latices with different surface charge densities were prepared from styrene/NaSS comonomers using the two-stage shot-growth process. After purification of the seed latices, they were used in seeded emulsion polymerization of methyl methacrylate. The initial rate of polymerization and the average number of radicals per particle for the high-charged seed latex system were lower than that of the low-charged case. The low rate of polymerization resulted from the low rate of radical adsorption in the beginning of the reaction due to the electrical repulsion between seeds and oligomeric radicals. In this case, because of the secondary particles, particle size distribution became bimodal. The low rate of radical adsorption and the formation of secondary particles reduced the average number of radicals per particle. The rate of polymerization (Rp) increased, but the rate of polymerization per particle (RP/NP) decreased.
AB - Experiments were carried out to investigate the effects of surface charge density on emulsion kinetics and secondary particle formation in emulsifier-free seeded emulsion polymerization. Three monodisperse seed latices with different surface charge densities were prepared from styrene/NaSS comonomers using the two-stage shot-growth process. After purification of the seed latices, they were used in seeded emulsion polymerization of methyl methacrylate. The initial rate of polymerization and the average number of radicals per particle for the high-charged seed latex system were lower than that of the low-charged case. The low rate of polymerization resulted from the low rate of radical adsorption in the beginning of the reaction due to the electrical repulsion between seeds and oligomeric radicals. In this case, because of the secondary particles, particle size distribution became bimodal. The low rate of radical adsorption and the formation of secondary particles reduced the average number of radicals per particle. The rate of polymerization (Rp) increased, but the rate of polymerization per particle (RP/NP) decreased.
KW - Average number of radicals per particle
KW - Electrical repulsion
KW - Rate of polymerization per particle
KW - Secondary particle formation
KW - Surface charge density
UR - http://www.scopus.com/inward/record.url?scp=0000735425&partnerID=8YFLogxK
U2 - 10.1007/s003960050142
DO - 10.1007/s003960050142
M3 - Article
AN - SCOPUS:0000735425
SN - 0303-402X
VL - 275
SP - 736
EP - 743
JO - Colloid and Polymer Science
JF - Colloid and Polymer Science
IS - 8
ER -