Abstract
We studied the relationship between the surface smoothness of the internal Cu ribbon and the morphology of the Sn-Pb plating layer for solar cell modules. A bumpy surface was observed on the surface of the solar ribbon, which caused irregular reflection of light. Large, Pb-rich, primary α-phases were found below the convex surface of the solar ribbon, passing from the surface of the internal Cu ribbon to the surface of the plating layer. The primary α-phases heterogeneously nucleated on the convex surface of the Cu ribbon, and then largely grew to the convex surface of the plating layer. The restriction of the primary α-phase's formation was enabled by enhancing the smoothness of the Cu ribbon's surface; it was also possible to increase the adhesive strength and decrease contact resistance. We confirmed that the solar ribbon's surface smoothness depends on the internal Cu ribbon's surface smoothness.
Original language | English |
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Pages (from-to) | 20-24 |
Number of pages | 5 |
Journal | Transactions on Electrical and Electronic Materials |
Volume | 16 |
Issue number | 1 |
DOIs | |
State | Published - 2015 |
Keywords
- Energy materials
- Morphology
- Sn-Pb solder
- Solar ribbon
- Surface smoothness