Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology

Duk Soo Eun; Hyung Jin Park; Dae Young Kong; Seong Ho Kong; Pyung Choi; Jang Kyoo Shin; Jong Hyun Lee

Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology

Duk Soo Eun, Hyung Jin Park, Dae Young Kong, Seong Ho Kong, Pyung Choi, Jang Kyoo Shin, Jong Hyun Lee

School of Electronics Engineering

Kyungpook National University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	English
Title of host publication	Digest of Papers - Microprocesses and Nanotechnology 2005
Subtitle of host publication	2005 International Microprocesses and Nanotechnology Conference
Pages	214-215
Number of pages	2
State	Published - 2005
Event	2005 International Microprocesses and Nanotechnology Conference - Tokyo, Japan Duration: 25 Oct 2005 → 28 Oct 2005

Publication series

Name	Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference
Volume	2005

Conference

Conference	2005 International Microprocesses and Nanotechnology Conference
Country/Territory	Japan
City	Tokyo
Period	25/10/05 → 28/10/05

Cite this

Eun, D. S., Park, H. J., Kong, D. Y., Kong, S. H., Choi, P., Shin, J. K., & Lee, J. H. (2005). Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology. In Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference (pp. 214-215). Article 1595290 (Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference; Vol. 2005).

Eun, Duk Soo ; Park, Hyung Jin ; Kong, Dae Young et al. / Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology. Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference. 2005. pp. 214-215 (Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference).

@inproceedings{9799d922b65641b68f02910a0fa06844,

title = "Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology",

author = "Eun, {Duk Soo} and Park, {Hyung Jin} and Kong, {Dae Young} and Kong, {Seong Ho} and Pyung Choi and Shin, {Jang Kyoo} and Lee, {Jong Hyun}",

year = "2005",

language = "English",

isbn = "4990247221",

series = "Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference",

pages = "214--215",

booktitle = "Digest of Papers - Microprocesses and Nanotechnology 2005",

note = "2005 International Microprocesses and Nanotechnology Conference ; Conference date: 25-10-2005 Through 28-10-2005",

}

Eun, DS, Park, HJ, Kong, DY, Kong, SH, Choi, P, Shin, JK & Lee, JH 2005, Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology. in Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference., 1595290, Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference, vol. 2005, pp. 214-215, 2005 International Microprocesses and Nanotechnology Conference, Tokyo, Japan, 25/10/05.

Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology. / Eun, Duk Soo; Park, Hyung Jin; Kong, Dae Young et al.
Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference. 2005. p. 214-215 1595290 (Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology

AU - Eun, Duk Soo

AU - Park, Hyung Jin

AU - Kong, Dae Young

AU - Kong, Seong Ho

AU - Choi, Pyung

AU - Shin, Jang Kyoo

AU - Lee, Jong Hyun

PY - 2005

Y1 - 2005

UR - http://www.scopus.com/inward/record.url?scp=33847221150&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:33847221150

SN - 4990247221

SN - 9784990247225

T3 - Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference

SP - 214

EP - 215

BT - Digest of Papers - Microprocesses and Nanotechnology 2005

T2 - 2005 International Microprocesses and Nanotechnology Conference

Y2 - 25 October 2005 through 28 October 2005

ER -

Eun DS, Park HJ, Kong DY, Kong SH, Choi P, Shin JK et al. Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology. In Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference. 2005. p. 214-215. 1595290. (Digest of Papers - Microprocesses and Nanotechnology 2005: 2005 International Microprocesses and Nanotechnology Conference).

Fabrication of a three-dimensional multi-chamber using polymer bonding and MEMS technology

Publication series

Conference

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