Fabrication of BeCu module probe array using heating and fusing currents

Dongin Lee; Sangwon Kim; Daeyoung Kong; Chanseob Cho; Bonghwan Kim; Byeungleul Lee; Jonghyun Lee

doi:10.1109/ICSENS.2011.6126958

Fabrication of BeCu module probe array using heating and fusing currents

Dongin Lee
, Sangwon Kim
, Daeyoung Kong
, Chanseob Cho
, Bonghwan Kim
, Byeungleul Lee
, Jonghyun Lee

School of Electronics Engineering

Kyungpook National University
Catholic University of Daegu
Korea University of Technology and Education

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

We have developed a novel probe array using BeCu sheets, to solve the high-production-cost problem associated with conventional MEMS probe cards. The BeCu probe has a simple structure and offers several advantages such as ease of fabrication and rapid prototyping; further, the fabrication process is cost-effective. The proposed array was fabricated by applying a suitable heating current (for plastic deformation via Joule heating) and fusing current (for cutting the array) to a BeCu beam. The stress relaxation time was 7 min during the application of a heating current of 4 A, and the fusing current was 20 A. The fabricated probe array is suitable for use in various complicated semiconductor chip tests.

Original language	English
Title of host publication	IEEE Sensors 2011 Conference, SENSORS 2011
Pages	1732-1735
Number of pages	4
DOIs	https://doi.org/10.1109/ICSENS.2011.6126958
State	Published - 2011
Event	10th IEEE SENSORS Conference 2011, SENSORS 2011 - Limerick, Ireland Duration: 28 Oct 2011 → 31 Oct 2011

Publication series

Name	Proceedings of IEEE Sensors

Conference

Conference	10th IEEE SENSORS Conference 2011, SENSORS 2011
Country/Territory	Ireland
City	Limerick
Period	28/10/11 → 31/10/11

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10.1109/ICSENS.2011.6126958

Cite this

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title = "Fabrication of BeCu module probe array using heating and fusing currents",

abstract = "We have developed a novel probe array using BeCu sheets, to solve the high-production-cost problem associated with conventional MEMS probe cards. The BeCu probe has a simple structure and offers several advantages such as ease of fabrication and rapid prototyping; further, the fabrication process is cost-effective. The proposed array was fabricated by applying a suitable heating current (for plastic deformation via Joule heating) and fusing current (for cutting the array) to a BeCu beam. The stress relaxation time was 7 min during the application of a heating current of 4 A, and the fusing current was 20 A. The fabricated probe array is suitable for use in various complicated semiconductor chip tests.",

author = "Dongin Lee and Sangwon Kim and Daeyoung Kong and Chanseob Cho and Bonghwan Kim and Byeungleul Lee and Jonghyun Lee",

year = "2011",

doi = "10.1109/ICSENS.2011.6126958",

language = "English",

isbn = "9781424492886",

series = "Proceedings of IEEE Sensors",

pages = "1732--1735",

booktitle = "IEEE Sensors 2011 Conference, SENSORS 2011",

note = "10th IEEE SENSORS Conference 2011, SENSORS 2011 ; Conference date: 28-10-2011 Through 31-10-2011",

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TY - GEN

T1 - Fabrication of BeCu module probe array using heating and fusing currents

AU - Lee, Dongin

AU - Kim, Sangwon

AU - Kong, Daeyoung

AU - Cho, Chanseob

AU - Kim, Bonghwan

AU - Lee, Byeungleul

AU - Lee, Jonghyun

PY - 2011

Y1 - 2011

N2 - We have developed a novel probe array using BeCu sheets, to solve the high-production-cost problem associated with conventional MEMS probe cards. The BeCu probe has a simple structure and offers several advantages such as ease of fabrication and rapid prototyping; further, the fabrication process is cost-effective. The proposed array was fabricated by applying a suitable heating current (for plastic deformation via Joule heating) and fusing current (for cutting the array) to a BeCu beam. The stress relaxation time was 7 min during the application of a heating current of 4 A, and the fusing current was 20 A. The fabricated probe array is suitable for use in various complicated semiconductor chip tests.

AB - We have developed a novel probe array using BeCu sheets, to solve the high-production-cost problem associated with conventional MEMS probe cards. The BeCu probe has a simple structure and offers several advantages such as ease of fabrication and rapid prototyping; further, the fabrication process is cost-effective. The proposed array was fabricated by applying a suitable heating current (for plastic deformation via Joule heating) and fusing current (for cutting the array) to a BeCu beam. The stress relaxation time was 7 min during the application of a heating current of 4 A, and the fusing current was 20 A. The fabricated probe array is suitable for use in various complicated semiconductor chip tests.

UR - https://www.scopus.com/pages/publications/84863082584

U2 - 10.1109/ICSENS.2011.6126958

DO - 10.1109/ICSENS.2011.6126958

M3 - Conference contribution

AN - SCOPUS:84863082584

SN - 9781424492886

T3 - Proceedings of IEEE Sensors

SP - 1732

EP - 1735

BT - IEEE Sensors 2011 Conference, SENSORS 2011

T2 - 10th IEEE SENSORS Conference 2011, SENSORS 2011

Y2 - 28 October 2011 through 31 October 2011

ER -

Fabrication of BeCu module probe array using heating and fusing currents

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