Fabrication of conductive electrode on flexible substrate using ag nanoparticle ink by transfer printing method

Joon Chan Choi, Ji Sub Park, Gyeong Tae Park, Jae Hyun Kim, Min Kyu Park, Imtiaz Mahmud, Jin Hyuk Bae, Hak Rin Kim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We fabricated highly conductive electrode on flexible substrate using metal nanoparticle ink by thermal sintering and transfer printing method. To enhance transfer printing, polymeric buffer layer etching process was introduced. Furthermore, an adhesion layer was used to improve bending stability.

Original languageEnglish
Title of host publication21st International Display Workshops 2014, IDW 2014
PublisherSociety for Information Display
Pages1491-1494
Number of pages4
ISBN (Electronic)9781510827790
StatePublished - 2014
Event21st International Display Workshops 2014, IDW 2014 - Niigata, Japan
Duration: 3 Dec 20145 Dec 2014

Publication series

Name21st International Display Workshops 2014, IDW 2014
Volume2

Conference

Conference21st International Display Workshops 2014, IDW 2014
Country/TerritoryJapan
CityNiigata
Period3/12/145/12/14

Keywords

  • Flexible electrode
  • Metal nanoparticle ink
  • Polymeric buffer layer
  • Sintering
  • Transfer printing

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