Fabrication of low frequency AC-DC thermal converter with a thermal mass

Su Lack Jung; Duk Soo Eun; Do Wook Kim; Seong Ho Kong; Jung Hee Lee; Jang Kyoo Shin; Jong Hyun Lee

Fabrication of low frequency AC-DC thermal converter with a thermal mass

Su Lack Jung
, Duk Soo Eun
, Do Wook Kim
, Seong Ho Kong
, Jung Hee Lee
, Jang Kyoo Shin
, Jong Hyun Lee

School of Electronics Engineering

Kyungpook National University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

The development of thin-film or planar multijunction thermal converters for smaller ac-dc transfer of voltage and current at low frequencies was presented. A planar Chromel-Alumel multijunction thermal converter was fabricated on the LPCVD Si₃N₄/SiO₂/Si₃N₄ (N/O/N)-diaphram, prepared by silicon bulk micromachining. A silicon obelisk integrator under the heater formed using KOH anisotropic etching. The values for the thermal time-constant, the ac-dc voltage transfer differences, and the current transfer differences are found to satisfy the specifications for the converter to be applied for ac standards.

Original language	English
Title of host publication	Digest of Papers - Microprocesses and Nanotechnology 2004
Pages	268-269
Number of pages	2
State	Published - 2004
Event	2004 International Microprocesses and Nanotechnology Conference - Osaka, Japan Duration: 26 Oct 2004 → 29 Oct 2004

Publication series

Name	Digest of Papers - Microprocesses and Nanotechnology 2004

Conference

Conference	2004 International Microprocesses and Nanotechnology Conference
Country/Territory	Japan
City	Osaka
Period	26/10/04 → 29/10/04

Cite this

@inproceedings{b4bd044a94e742b392abbbfabc15183d,

title = "Fabrication of low frequency AC-DC thermal converter with a thermal mass",

abstract = "The development of thin-film or planar multijunction thermal converters for smaller ac-dc transfer of voltage and current at low frequencies was presented. A planar Chromel-Alumel multijunction thermal converter was fabricated on the LPCVD Si3N4/SiO2/Si3N4 (N/O/N)-diaphram, prepared by silicon bulk micromachining. A silicon obelisk integrator under the heater formed using KOH anisotropic etching. The values for the thermal time-constant, the ac-dc voltage transfer differences, and the current transfer differences are found to satisfy the specifications for the converter to be applied for ac standards.",

author = "Jung, \{Su Lack\} and Eun, \{Duk Soo\} and Kim, \{Do Wook\} and Kong, \{Seong Ho\} and Lee, \{Jung Hee\} and Shin, \{Jang Kyoo\} and Lee, \{Jong Hyun\}",

year = "2004",

language = "English",

isbn = "4990247205",

series = "Digest of Papers - Microprocesses and Nanotechnology 2004",

pages = "268--269",

booktitle = "Digest of Papers - Microprocesses and Nanotechnology 2004",

note = "2004 International Microprocesses and Nanotechnology Conference ; Conference date: 26-10-2004 Through 29-10-2004",

}

TY - GEN

T1 - Fabrication of low frequency AC-DC thermal converter with a thermal mass

AU - Jung, Su Lack

AU - Eun, Duk Soo

AU - Kim, Do Wook

AU - Kong, Seong Ho

AU - Lee, Jung Hee

AU - Shin, Jang Kyoo

AU - Lee, Jong Hyun

PY - 2004

Y1 - 2004

N2 - The development of thin-film or planar multijunction thermal converters for smaller ac-dc transfer of voltage and current at low frequencies was presented. A planar Chromel-Alumel multijunction thermal converter was fabricated on the LPCVD Si3N4/SiO2/Si3N4 (N/O/N)-diaphram, prepared by silicon bulk micromachining. A silicon obelisk integrator under the heater formed using KOH anisotropic etching. The values for the thermal time-constant, the ac-dc voltage transfer differences, and the current transfer differences are found to satisfy the specifications for the converter to be applied for ac standards.

AB - The development of thin-film or planar multijunction thermal converters for smaller ac-dc transfer of voltage and current at low frequencies was presented. A planar Chromel-Alumel multijunction thermal converter was fabricated on the LPCVD Si3N4/SiO2/Si3N4 (N/O/N)-diaphram, prepared by silicon bulk micromachining. A silicon obelisk integrator under the heater formed using KOH anisotropic etching. The values for the thermal time-constant, the ac-dc voltage transfer differences, and the current transfer differences are found to satisfy the specifications for the converter to be applied for ac standards.

UR - https://www.scopus.com/pages/publications/23244458501

M3 - Conference contribution

AN - SCOPUS:23244458501

SN - 4990247205

T3 - Digest of Papers - Microprocesses and Nanotechnology 2004

SP - 268

EP - 269

BT - Digest of Papers - Microprocesses and Nanotechnology 2004

T2 - 2004 International Microprocesses and Nanotechnology Conference

Y2 - 26 October 2004 through 29 October 2004

ER -

Fabrication of low frequency AC-DC thermal converter with a thermal mass

Abstract

Publication series

Conference

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