Fabrication of thermal conductive adhesive using Ni graphite core-shell and application to LED lighting

High-power light-emitting diode (LED) lighting exhibits excessive heat generation owing to the need to drive an LED chip, development of heat dissipation technology is required to resolve that problem. Until now, most of the studies on heat dissipation in LED lighting have been limited to research on heat dissipation of the chip itself and research into the manufacture of heat sinks. However, a solution in a new direction is required owing to the quantity of heat generated from dense LED chips found in high-power LED lighting or in situations where the space for the lighting is limited owing to its location. In this research, heat dissipation characteristics were improved by adding a Ni-graphite core-shell (Ni-GCS) to the thermally conductive adhesive used to bond the LED chip's substrate to the heat sink in high-power LED lighting applications. Ni-GCS was synthesized through thermal chemical vaper deposition (thermal-CVD), and the Ni nanoparticles were confirmed are to be wrapped by a graphite layer. When high-power LED lighting using the novel thermally conductive adhesive was driven over a long period of time, improved heat dissipation characteristics were observed when the properties of the thermal changes were analyzed.