TY - JOUR
T1 - Finite element analysis of underwater capacitor micromachined ultrasonic transducers
AU - Roh, Yongrae
AU - Khuri-Yakub, Butrus T.
PY - 2002/3
Y1 - 2002/3
N2 - A simple electro-mechanical equivalent circuit model is used to predict the behavior of capacitive micromachined ultrasonic transducers (cMUT). Most often, cMUTs are made in silicon and glass plates that are in the 0.5 mm to 1 mm range in thickness. The equivalent circuit model of the cMUT lacks important features such as coupling to the substrate and the ability to predict cross-talk between elements of an array of transducers. To overcome these deficiencies, a finite element model of the cMUT is constructed using the commercial code ANSYS®. Calculation results of the complex load impedance seen by single capacitor cells are presented, then followed by a calculation of the plane wave real load impedance seen by a parallel combination of many cells that are used to make a transducer. Cross-talk between 1-D array elements is found to be due to two main sources: coupling through a Stoneley wave propagating at the transducer-water interface and coupling through Lamb waves propagating in the substrate. To reduce the cross-talk level, the effect of structural variations of the substrate are investigated, which includes a change of its thickness and etched trenches or polymer walls between array elements.
AB - A simple electro-mechanical equivalent circuit model is used to predict the behavior of capacitive micromachined ultrasonic transducers (cMUT). Most often, cMUTs are made in silicon and glass plates that are in the 0.5 mm to 1 mm range in thickness. The equivalent circuit model of the cMUT lacks important features such as coupling to the substrate and the ability to predict cross-talk between elements of an array of transducers. To overcome these deficiencies, a finite element model of the cMUT is constructed using the commercial code ANSYS®. Calculation results of the complex load impedance seen by single capacitor cells are presented, then followed by a calculation of the plane wave real load impedance seen by a parallel combination of many cells that are used to make a transducer. Cross-talk between 1-D array elements is found to be due to two main sources: coupling through a Stoneley wave propagating at the transducer-water interface and coupling through Lamb waves propagating in the substrate. To reduce the cross-talk level, the effect of structural variations of the substrate are investigated, which includes a change of its thickness and etched trenches or polymer walls between array elements.
UR - http://www.scopus.com/inward/record.url?scp=0036488952&partnerID=8YFLogxK
U2 - 10.1109/58.990939
DO - 10.1109/58.990939
M3 - Article
C2 - 12322877
AN - SCOPUS:0036488952
SN - 0885-3010
VL - 49
SP - 293
EP - 298
JO - IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
JF - IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
IS - 3
ER -