Abstract
We present the method for five-step (pad-pad short-pad open-short-open) on-chip parasitic de-embedding. Its validation is verified by gate electrode resistance and input capacitance of transistors based on 45-nm CMOS process. Optimized dummy structures to remove the parasitic components due to the pad and routing metal are proposed. Parameters extracted by the proposed method have excellent physical and theoretical trends.
Original language | English |
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Pages (from-to) | 398-400 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 30 |
Issue number | 4 |
DOIs | |
State | Published - 2009 |
Keywords
- Gate electrode resistance
- Input capacitance
- On-wafer RF measurement
- Parasitic de-embedding
- RF MOSFETs