@inproceedings{7f796aba0aad49b5a86c3232f0884ca3,
title = "Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs",
abstract = "TSV-to-TSV coupling is a new parasitic element in 3D ICs and can become a significant source of signal integrity problem. Existing studies on its extraction, however, becomes highly inaccurate when handling more than two TSVs on full-chip scale. In this paper we investigate the multiple TSV-to-TSV coupling issue and propose an accurate model that can be efficiently used for full-chip extraction. Unlike the common belief that only the closest neighboring TSVs affect the victim, our study shows that non-neighboring aggressors also cause non-negligible impact. Based on this observation, we propose an effective method of reducing the overall coupling level in multiple TSV cases.",
keywords = "3D IC, Coupling, TSV, TSV-to-TSV coupling",
author = "Taigon Song and Chang Liu and Yarui Peng and Lim, {Sung Kyu}",
year = "2013",
doi = "10.1145/2463209.2488956",
language = "English",
isbn = "9781450320719",
series = "Proceedings - Design Automation Conference",
booktitle = "Proceedings of the 50th Annual Design Automation Conference, DAC 2013",
note = "50th Annual Design Automation Conference, DAC 2013 ; Conference date: 29-05-2013 Through 07-06-2013",
}