Glass forming ability and crystallization behaviors of the Ti-Cu-Ni-(Sn) alloys with large supercooled liquid region

Y. C. Kim; S. Yi; W. T. Kim; D. H. Kim

doi:10.4028/www.scientific.net/msf.360-362.67

Glass forming ability and crystallization behaviors of the Ti-Cu-Ni-(Sn) alloys with large supercooled liquid region

Y. C. Kim, S. Yi, W. T. Kim, D. H. Kim

Yonsei University

Research output: Contribution to journal › Conference article › peer-review

29 Scopus citations

Abstract

The thermal stability and crystallization behavior of melt spun amorphous Ti-Cu-Ni-(Sn) alloys are investigated by thermal analysis and structural characterization with the intention to find alloy composition with wide supercooled liquid regime ΔT_x. ΔT_x of amorphous Ti₅₀Cu_50-xNi_x alloys increased with increasing Ni content up to 15 at% and then decreased with further increasing. Maximum ΔT_x of 46 K was obtained in Ti₅₀Cu₃₅Ni₁₅ alloy. Partial replacement of Cu by Sn improved thermal stability of amorphous phase and ΔT_x. Maximum ΔT_x of 73 K was obtained from melt spun amorphous Ti₅₀Cu₃₂Ni₁₅Sn₃ alloy. Amorphous Ti₅₀Cu₃₅Ni₁₅ alloy crystallized by precipitation of supersaturated cubic Ti(Ni,Cu) phase followed by decomposition into a mixture of TiCu and TiNi at higher temperature. Amorphous Ti₅₀Cu₃₂Ni₁₅Sn₃ phase crystallized by co-precipitation of Ti(Ni,Cu) phase and Ti₂Ni phases, followed by transformation into a mixture of TiNi, TiCu, Ti₃Sn phases.

Original language	English
Pages (from-to)	67-72
Number of pages	6
Journal	Materials Science Forum
Volume	360-362
DOIs	https://doi.org/10.4028/www.scientific.net/msf.360-362.67
State	Published - 2001
Event	Metastable, Mechanically Alloyed and Nanocrystalline Materials (ISMANAM 2000) - Oxford, United Kingdom Duration: 9 Jul 2000 → 14 Jul 2000

Keywords

Crystallization
Glass forming ability
Thermal stability
Ti-Cu-Ni-Sn alloy

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title = "Glass forming ability and crystallization behaviors of the Ti-Cu-Ni-(Sn) alloys with large supercooled liquid region",

abstract = "The thermal stability and crystallization behavior of melt spun amorphous Ti-Cu-Ni-(Sn) alloys are investigated by thermal analysis and structural characterization with the intention to find alloy composition with wide supercooled liquid regime ΔTx. ΔTx of amorphous Ti50Cu50-xNix alloys increased with increasing Ni content up to 15 at% and then decreased with further increasing. Maximum ΔTx of 46 K was obtained in Ti50Cu35Ni15 alloy. Partial replacement of Cu by Sn improved thermal stability of amorphous phase and ΔTx. Maximum ΔTx of 73 K was obtained from melt spun amorphous Ti50Cu32Ni15Sn3 alloy. Amorphous Ti50Cu35Ni15 alloy crystallized by precipitation of supersaturated cubic Ti(Ni,Cu) phase followed by decomposition into a mixture of TiCu and TiNi at higher temperature. Amorphous Ti50Cu32Ni15Sn3 phase crystallized by co-precipitation of Ti(Ni,Cu) phase and Ti2Ni phases, followed by transformation into a mixture of TiNi, TiCu, Ti3Sn phases.",

keywords = "Crystallization, Glass forming ability, Thermal stability, Ti-Cu-Ni-Sn alloy",

author = "Kim, {Y. C.} and S. Yi and Kim, {W. T.} and Kim, {D. H.}",

year = "2001",

doi = "10.4028/www.scientific.net/msf.360-362.67",

language = "English",

volume = "360-362",

pages = "67--72",

journal = "Materials Science Forum",

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note = "Metastable, Mechanically Alloyed and Nanocrystalline Materials (ISMANAM 2000) ; Conference date: 09-07-2000 Through 14-07-2000",

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TY - JOUR

T1 - Glass forming ability and crystallization behaviors of the Ti-Cu-Ni-(Sn) alloys with large supercooled liquid region

AU - Kim, Y. C.

AU - Yi, S.

AU - Kim, W. T.

AU - Kim, D. H.

PY - 2001

Y1 - 2001

N2 - The thermal stability and crystallization behavior of melt spun amorphous Ti-Cu-Ni-(Sn) alloys are investigated by thermal analysis and structural characterization with the intention to find alloy composition with wide supercooled liquid regime ΔTx. ΔTx of amorphous Ti50Cu50-xNix alloys increased with increasing Ni content up to 15 at% and then decreased with further increasing. Maximum ΔTx of 46 K was obtained in Ti50Cu35Ni15 alloy. Partial replacement of Cu by Sn improved thermal stability of amorphous phase and ΔTx. Maximum ΔTx of 73 K was obtained from melt spun amorphous Ti50Cu32Ni15Sn3 alloy. Amorphous Ti50Cu35Ni15 alloy crystallized by precipitation of supersaturated cubic Ti(Ni,Cu) phase followed by decomposition into a mixture of TiCu and TiNi at higher temperature. Amorphous Ti50Cu32Ni15Sn3 phase crystallized by co-precipitation of Ti(Ni,Cu) phase and Ti2Ni phases, followed by transformation into a mixture of TiNi, TiCu, Ti3Sn phases.

AB - The thermal stability and crystallization behavior of melt spun amorphous Ti-Cu-Ni-(Sn) alloys are investigated by thermal analysis and structural characterization with the intention to find alloy composition with wide supercooled liquid regime ΔTx. ΔTx of amorphous Ti50Cu50-xNix alloys increased with increasing Ni content up to 15 at% and then decreased with further increasing. Maximum ΔTx of 46 K was obtained in Ti50Cu35Ni15 alloy. Partial replacement of Cu by Sn improved thermal stability of amorphous phase and ΔTx. Maximum ΔTx of 73 K was obtained from melt spun amorphous Ti50Cu32Ni15Sn3 alloy. Amorphous Ti50Cu35Ni15 alloy crystallized by precipitation of supersaturated cubic Ti(Ni,Cu) phase followed by decomposition into a mixture of TiCu and TiNi at higher temperature. Amorphous Ti50Cu32Ni15Sn3 phase crystallized by co-precipitation of Ti(Ni,Cu) phase and Ti2Ni phases, followed by transformation into a mixture of TiNi, TiCu, Ti3Sn phases.

KW - Crystallization

KW - Glass forming ability

KW - Thermal stability

KW - Ti-Cu-Ni-Sn alloy

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DO - 10.4028/www.scientific.net/msf.360-362.67

M3 - Conference article

AN - SCOPUS:0034998147

SN - 0255-5476

VL - 360-362

SP - 67

EP - 72

JO - Materials Science Forum

JF - Materials Science Forum

T2 - Metastable, Mechanically Alloyed and Nanocrystalline Materials (ISMANAM 2000)

Y2 - 9 July 2000 through 14 July 2000

ER -

Glass forming ability and crystallization behaviors of the Ti-Cu-Ni-(Sn) alloys with large supercooled liquid region

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Keywords

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