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High-temperature insulating polyimide aerogels with a hierarchical porous hyper-cross-linked structure derived from aqueous polymerization of mesostructured silica-grafted Poly(amic acid) salt

  • Kyungpook National University
  • Korea Institute of Science and Technology

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Polyimide (PI) aerogels have garnered significant interest in thermal protection applications because of their excellent high-temperature resistance and broad operational range. Nevertheless, there are still research challenges, such as the extensive use of organic solvents, shrinkage during drying, and the need for improved thermal/electrical insulation and mechanical properties. Addressing these challenges is crucial for enhancing the practical application of PI aerogels in demanding environments. Herein, we propose a facile, green, and scalable method for fabricating freeze-dried PI aerogels via the aqueous polymerization of amino-functionalized mesoporous silica-grafted poly(amic acid) salts (PAAS-g-AMS). Our findings demonstrate that water-borne PI (W-PI)-g-AMS aerogels have a three-dimensional covalent network with a macroporous/mesoporous architecture, which minimizes molecular chain slippage and shrinkage during thermal imidization. The W-PI-g-AMS aerogels possess excellent properties, such as high porosity (>91 %), a low bulk density (122.4 mg cm−3), minimal shrinkage (8.1 %), good compressive strength (6.15 MPa) and modulus (1.86 MPa), a high degradation temperature (Td5 % = 599.4 °C), a low fire growth rate index (0.075 W g−1 s−1), low thermal conductivity (0.08241 W m−1 K−1), and a remarkably low dielectric constant (Dk = 1.25 at 1 MHz) and dissipation factor (Df = 0.001 at 1 MHz), indicating their potential for use as substitute materials for thermal and electrical superinsulation in the aerospace and transportation industries in extreme environments.

Original languageEnglish
Article number108797
JournalPolymer Testing
Volume147
DOIs
StatePublished - Jun 2025

Keywords

  • Electrical insulation
  • Mesostructured silica cross-linker
  • Polyimide aerogel
  • Thermal insulation
  • Water-borne poly(amic acid) salt

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