TY - JOUR
T1 - Illuminating Recent Progress in Nanotransfer Printing
T2 - Core Principles, Emerging Applications, and Future Perspectives
AU - Ahn, Junseong
AU - Jang, Hanhwi
AU - Jeong, Yongrok
AU - Choi, Seongsu
AU - Ko, Jiwoo
AU - Hwang, Soon Hyoung
AU - Jeong, Jun Ho
AU - Jung, Yeon Sik
AU - Park, Inkyu
N1 - Publisher Copyright:
© 2023 The Authors. Advanced Science published by Wiley-VCH GmbH.
PY - 2024/1/5
Y1 - 2024/1/5
N2 - As the demand for diverse nanostructures in physical/chemical devices continues to rise, the development of nanotransfer printing (nTP) technology is receiving significant attention due to its exceptional throughput and ease of use. Over the past decade, researchers have attempted to enhance the diversity of materials and substrates used in transfer processes as well as to improve the resolution, reliability, and scalability of nTP. Recent research on nTP has made continuous progress, particularly using the control of the interfacial adhesion force between the donor mold, target material, and receiver substrate, and numerous practical nTP methods with niche applications have been demonstrated. This review article offers a comprehensive analysis of the chronological advancements in nTP technology and categorizes recent strategies targeted for high-yield and versatile printing based on controlling the relative adhesion force depending on interfacial layers. In detail, the advantages and challenges of various nTP approaches are discussed based on their working mechanisms, and several promising solutions to improve morphological/material diversity are presented. Furthermore, this review provides a summary of potential applications of nanostructured devices, along with perspectives on the outlook and remaining challenges, which are expected to facilitate the continued progress of nTP technology and to inspire future innovations.
AB - As the demand for diverse nanostructures in physical/chemical devices continues to rise, the development of nanotransfer printing (nTP) technology is receiving significant attention due to its exceptional throughput and ease of use. Over the past decade, researchers have attempted to enhance the diversity of materials and substrates used in transfer processes as well as to improve the resolution, reliability, and scalability of nTP. Recent research on nTP has made continuous progress, particularly using the control of the interfacial adhesion force between the donor mold, target material, and receiver substrate, and numerous practical nTP methods with niche applications have been demonstrated. This review article offers a comprehensive analysis of the chronological advancements in nTP technology and categorizes recent strategies targeted for high-yield and versatile printing based on controlling the relative adhesion force depending on interfacial layers. In detail, the advantages and challenges of various nTP approaches are discussed based on their working mechanisms, and several promising solutions to improve morphological/material diversity are presented. Furthermore, this review provides a summary of potential applications of nanostructured devices, along with perspectives on the outlook and remaining challenges, which are expected to facilitate the continued progress of nTP technology and to inspire future innovations.
KW - nanofabrication
KW - nanoimprinting lithography
KW - nanopatterning
KW - nanotransfer printing
KW - surface adhesion engineering
UR - http://www.scopus.com/inward/record.url?scp=85178199913&partnerID=8YFLogxK
U2 - 10.1002/advs.202303704
DO - 10.1002/advs.202303704
M3 - Review article
C2 - 38032705
AN - SCOPUS:85178199913
SN - 2198-3844
VL - 11
JO - Advanced Science
JF - Advanced Science
IS - 1
M1 - 2303704
ER -