Integrated 3D Active Noise Cancellation Simulation and Synthesis Platform Using Tcl

Seunghyun Park, Daejin Park

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

As the virtual reality market has grown, implementing an optimized virtual environment has become more important. Three-dimensional audio rendering is a crucial aspect of virtual reality. External interference, such as acoustic noise, should be minimized to build a system where users can fully immerse themselves in the virtual world. Active noise cancellation allows users to analyze and process the noise in real time. Recently, audio signal processing methods that use deep learning have been widely studied. However, utilizing deep learning models at runtime can be challenging, thus requiring a suitable external simulation environment, including hardware accelerators. In this paper, we propose a Tcl-based active noise cancellation platform for the removal of three-dimensional noise components. This platform constructs a noise library using temporal convolutional networks and selects filter weights to remove various types of noise. The experimental results show that it is possible to construct a library with a minimum delay of 10ms and a size of 36 bytes. This allowed for real time noise cancellation with short delay time and low memory requirement. In addition, various noise environments were experimented with using FPGA, and it was demonstrated that the signal-to-noise ratio improved by an average of 3.8dB.

Original languageEnglish
Title of host publicationProceedings - 2023 16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages111-116
Number of pages6
ISBN (Electronic)9798350393613
DOIs
StatePublished - 2023
Event16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023 - Singapore, Singapore
Duration: 18 Dec 202321 Dec 2023

Publication series

NameProceedings - 2023 16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023

Conference

Conference16th IEEE International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2023
Country/TerritorySingapore
CitySingapore
Period18/12/2321/12/23

Keywords

  • Acoustic noise field
  • ANC
  • BRIR
  • CNN
  • Tcl-based platform

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