Abstract
A synaptic device with a multilayer structure is proposed to reduce the operating power of neuromorphic computing systems while maintaining a high-density integration. A simple metal–insulator–metal (MIM)-structured multilayer synaptic device is developed using an 8-inch wafer-based and complementary metal–oxide–semiconductor (CMOS) fabrication process. The three types of MIM-structured synaptic devices are compared to assess their effects on reducing the operating power. The obtained results exhibited low-power operation owing to the inserted layers acting as an internal resistor. The modulated operational conductance level and simple MIM structure demonstrate the feasibility of implementing both low-power operation and high-density integration in multilayer synaptic devices.
| Original language | English |
|---|---|
| Article number | 201 |
| Journal | Nanomaterials |
| Volume | 14 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jan 2024 |
Keywords
- CMOS compatibility
- MIM structure
- inner resistor effect
- low-power operation
- multilayer synaptic device
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