TY - JOUR
T1 - Laser Direct Writing Process for Making Electrodes and High-k Sol-Gel ZrO2 for Boosting Performances of MoS2 Transistors
AU - Kwon, Hyuk Jun
AU - Jang, Jaewon
AU - Grigoropoulos, Costas P.
N1 - Publisher Copyright:
© 2016 American Chemical Society.
PY - 2016/4/27
Y1 - 2016/4/27
N2 - A series of two-dimensional (2D) transition metal dichalcogenides (TMDCs), including molybdenum disulfide (MoS2), can be attractive materials for photonic and electronic applications due to their exceptional properties. Among these unique properties, high mobility of 2D TMDCs enables realization of high-performance nanoelectronics based on a thin film transistor (TFT) platform. In this contribution, we report highly enhanced field effect mobility (μeff = 50.1 cm2/(V s), ∼2.5 times) of MoS2 TFTs through the sol-gel processed high-k ZrO2 (∼22.0) insulator, compared to those of typical MoS2/SiO2/Si structures (μeff = 19.4 cm2/(V s)) because a high-k dielectric layer can suppress Coulomb electron scattering and reduce interface trap concentration. Additionally, in order to avoid costly conventional mask based photolithography and define the patterns, we employ a simple laser direct writing (LDW) process. This process allows precise and flexible control with reasonable resolution (up to ∼10 nm), depending on the system, and enables fabrication of arbitrarily patterned devices. Taking advantage of continuing developments in laser technology offers a substantial cost decrease, and LDW may emerge as a promising technology.
AB - A series of two-dimensional (2D) transition metal dichalcogenides (TMDCs), including molybdenum disulfide (MoS2), can be attractive materials for photonic and electronic applications due to their exceptional properties. Among these unique properties, high mobility of 2D TMDCs enables realization of high-performance nanoelectronics based on a thin film transistor (TFT) platform. In this contribution, we report highly enhanced field effect mobility (μeff = 50.1 cm2/(V s), ∼2.5 times) of MoS2 TFTs through the sol-gel processed high-k ZrO2 (∼22.0) insulator, compared to those of typical MoS2/SiO2/Si structures (μeff = 19.4 cm2/(V s)) because a high-k dielectric layer can suppress Coulomb electron scattering and reduce interface trap concentration. Additionally, in order to avoid costly conventional mask based photolithography and define the patterns, we employ a simple laser direct writing (LDW) process. This process allows precise and flexible control with reasonable resolution (up to ∼10 nm), depending on the system, and enables fabrication of arbitrarily patterned devices. Taking advantage of continuing developments in laser technology offers a substantial cost decrease, and LDW may emerge as a promising technology.
KW - coulomb electron scattering
KW - interface trap
KW - laser direct writing
KW - MoS
KW - sol-gel high-k ZrO
KW - thin-film transistors
UR - http://www.scopus.com/inward/record.url?scp=84966330714&partnerID=8YFLogxK
U2 - 10.1021/acsami.5b11357
DO - 10.1021/acsami.5b11357
M3 - Article
AN - SCOPUS:84966330714
SN - 1944-8244
VL - 8
SP - 9314
EP - 9318
JO - ACS applied materials & interfaces
JF - ACS applied materials & interfaces
IS - 14
ER -