Laser-induced Deposition Method for Mask-less Copper Patterning on the Glass Substrate

This study investigated the Laser-Induced Plasma Backward Deposition (LIPBD) process for transparent glass-copper composite film production. LIPBD was compared with Laser-Induced Backward Transfer (LIBT). Controlling laser parameters and the z-axis position of Depth of focus (DOF) resulted in various post-deposition outcomes. The optimal deposition depth was 10 µm to 90 µm, ensuring good glass-copper adhesion. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) mapping confirmed copper and copper oxide (CuO) particles. X-ray diffraction confirmed Cu and CuO peaks. The adhesive test showed a strong binding between glass and deposition, but the parts of the cracks caused by heat accumulation were delaminated during the test. LIPBD offers controlled deposition potential for glass-copper composites. Optimizing laser parameters leads to high-quality films. This study provides valuable insights into nanotechnology and the semiconductor industry, with potential applications across diverse fields.