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Lateral field emission diode with wedge-type tip and nanogap on separation by implantation of oxygen silicon

  • Woo Jae Zang
  • , Jung Hee Lee
  • , Jong Hyun Lee
  • , Young Ho Bae
  • , Chang Auck Choi
  • , Sung Ho Hahm
  • Kyungpook National University
  • Uiduk University
  • Electronics and Telecommunications Research Institute

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The effectiveness and control parameters of a nanogap formation method using the thin film stress on a SIMOX (separation by implantation of oxygen) wafer were investigated. The fabricated nanogap lateral field effect arrays (FEA) exhibited excellent electrical characteristics. A lateral FEA fabricated by thermal stress-induced gap formation indicated that the device had a 25 V turn-on voltage and a 6 μA/tip emission current at a 35 V operating voltage.

Original languageEnglish
Pages (from-to)1006-1008
Number of pages3
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume18
Issue number2
DOIs
StatePublished - Mar 2000

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