Abstract
We have experimentally studied the suitability of nanometer-scale In0.7Ga0.3As high-electron mobility transistors (HEMTs) as an n-channel device for a future high-speed and low-power logic technology for beyond-CMOS applications. To this end, we have fabricated 50- to 150-nm-gate-length In0.7Ga0.3As HEMTs with different gate stack designs. This has allowed us to investigate the role of Schottky barrier height (ΦB) and insulator thickness tIns on the logic characteristics of In0.7Ga0.3As HEMTs. The best 50-nm HEMTs with the highest ΦB and the smallest trm ins exhibit an ION/IOFF ratio in excess of 104 and a subthreshold slope (S) below 86 mV/dec. These nonoptimized 50-nm In0.7Ga0.3As HEMTs also show a logic gate delay CV/ I of around 1 ps at a supply voltage of 0.5 V, while maintaining an IONIOFF ratio above 104, which is comparable to state-of-the-art Si MOSFETs. As one of the alternatives for beyond-CMOS technologies, we believe that InAs-rich InGaAs HEMTs hold a considerable promise.
Original language | English |
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Pages (from-to) | 2606-2613 |
Number of pages | 8 |
Journal | IEEE Transactions on Electron Devices |
Volume | 54 |
Issue number | 10 |
DOIs | |
State | Published - Oct 2007 |
Keywords
- Drain-induced barrier lowering (DIBL)
- Gate delay
- High-electron mobility transistor (HEMT)
- I/I
- InGaAs
- Logic
- Subthreshold slope
- f