TY - GEN
T1 - MEMS based flexible micro-supercapacitor as miniature high-power component
AU - Patii, Swati J.
AU - Park, Jongsung
AU - Lee, Dong Weon
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - Herein, a flexible micro-supercapacitor as a power component developed by compatible standard clean room micro-fabrication processes and then microelectrode decorated with nanomaterial by forming the thin layer. These nanostructures based NiCo2O4@polypyrrole//MEMS micro-supercapacitor (MSc) achieves an areal capacitance of 2.12 mF cm-2 at a scan rate of 2 mV s-1. The fabricated single MSc device can deliver the highest energy and power density of 0.14 mWh cm-2 and 120 mW cm-2, respectively. Furthermore, the power performance tests of the fabricated flexible MSc in series and parallel connections exhibit a good understanding of the commercial capacitor. Finally, the fabricated MSc has demonstrated its practical application with different bendable angles.
AB - Herein, a flexible micro-supercapacitor as a power component developed by compatible standard clean room micro-fabrication processes and then microelectrode decorated with nanomaterial by forming the thin layer. These nanostructures based NiCo2O4@polypyrrole//MEMS micro-supercapacitor (MSc) achieves an areal capacitance of 2.12 mF cm-2 at a scan rate of 2 mV s-1. The fabricated single MSc device can deliver the highest energy and power density of 0.14 mWh cm-2 and 120 mW cm-2, respectively. Furthermore, the power performance tests of the fabricated flexible MSc in series and parallel connections exhibit a good understanding of the commercial capacitor. Finally, the fabricated MSc has demonstrated its practical application with different bendable angles.
UR - https://www.scopus.com/pages/publications/85047009399
U2 - 10.1109/MEMSYS.2018.8346518
DO - 10.1109/MEMSYS.2018.8346518
M3 - Conference contribution
AN - SCOPUS:85047009399
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 198
EP - 201
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -